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WebAbstract. While plasma etching of wafers has been a mainstay of the semiconductor industry for more than 25 years, only in the last decade has dry-etch processing become … WebDNP. 2011 年 10 月 - 2014 年 4 月2 年 7 個月. Taiwan. • OMOG, Phase-Shift and Binary photomask dry etching process management. • Dry etching hard defect rate < 0.1%. • PM cycle time prolong as is 4 months to be 20 months. • Etching chamber reform to improve handling accuracy and plasma resistance property. dcxny dcergy.com
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